John Mitchell, IPC president and CEO, describes how IPC Standards IPC-2591 and IPC-HERMES-9852 are providing the electronics industry the building blocks for machine-to-machine and machine-to-ERP communications.
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The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Estimated reading time: 1 minute
John Mitchell, IPC president and CEO, describes how IPC Standards IPC-2591 and IPC-HERMES-9852 are providing the electronics industry the building blocks for machine-to-machine and machine-to-ERP communications.
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