-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
INSPECTIS Launches C12s ‘Stand-Alone’ Now in Flexible, Modular Format
August 2, 2019 | INSPECTIS ABEstimated reading time: 1 minute
INSPECTIS AB announces the launch of the new C12s digital camera, a new modular version of the very popular original Inspectis C12. The C12s offers a standalone camera format in a system for those requiring a flexible and cost-effective solution for visual inspection across all subjects.
The C12s camera uses the same large sensor unit as the original C12, delivering crisp, vivid images with auto focus and 12x zoom, can be mounted on any of the extensive range of INSPECTIS stands, and uses all of the available lighting and lens accessories to achieve the desired viewing conditions. Further accessories such as tilt stands, XY tables can be added to optimum object handling.
Cost effective and featuring superior optics and 12:1 optical zoom, the C12s is designed into a robust industrial-grade aluminum housing for high definition image quality. The C12s produces crisp pictures of inspection objects up to 90x magnification directly onto an LCD monitor or PC.
An optional built-in laser pointer aims at the area of interest and assists in locating it on the screen.
Due to the large size of its image sensor and pixel elements, the C12s provides excellent image rendering of such structures as solder joints on PCB assemblies with minimum glare and reflection.
The C12 offers true ease of use with minimal interaction needed with controls and settings. All basic parameters such as zoom, brightness and color levels can be controlled by the user through on-board buttons on top of the device, or through an optional remote control pad. With these control features, camera and lens attributes, including focus, aperture size, image contrast and white balance, are all controllable, and features including zoom factor display and a crosshair overlay on the live image can be turned on.
About Inspectis AB
INSPECTIS provides advanced optical inspection solutions for PCB assembly, high definition camera microscopes designed for non-contact optical inspection. For more information, visit www.inspect-is.com.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.