-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
INSPECTIS Launches C12s ‘Stand-Alone’ Now in Flexible, Modular Format
August 2, 2019 | INSPECTIS ABEstimated reading time: 1 minute

INSPECTIS AB announces the launch of the new C12s digital camera, a new modular version of the very popular original Inspectis C12. The C12s offers a standalone camera format in a system for those requiring a flexible and cost-effective solution for visual inspection across all subjects.
The C12s camera uses the same large sensor unit as the original C12, delivering crisp, vivid images with auto focus and 12x zoom, can be mounted on any of the extensive range of INSPECTIS stands, and uses all of the available lighting and lens accessories to achieve the desired viewing conditions. Further accessories such as tilt stands, XY tables can be added to optimum object handling.
Cost effective and featuring superior optics and 12:1 optical zoom, the C12s is designed into a robust industrial-grade aluminum housing for high definition image quality. The C12s produces crisp pictures of inspection objects up to 90x magnification directly onto an LCD monitor or PC.
An optional built-in laser pointer aims at the area of interest and assists in locating it on the screen.
Due to the large size of its image sensor and pixel elements, the C12s provides excellent image rendering of such structures as solder joints on PCB assemblies with minimum glare and reflection.
The C12 offers true ease of use with minimal interaction needed with controls and settings. All basic parameters such as zoom, brightness and color levels can be controlled by the user through on-board buttons on top of the device, or through an optional remote control pad. With these control features, camera and lens attributes, including focus, aperture size, image contrast and white balance, are all controllable, and features including zoom factor display and a crosshair overlay on the live image can be turned on.
About Inspectis AB
INSPECTIS provides advanced optical inspection solutions for PCB assembly, high definition camera microscopes designed for non-contact optical inspection. For more information, visit www.inspect-is.com.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.