Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT
August 7, 2019 | Nordson MARCHEstimated reading time: 2 minutes
Nordson MARCH, a Nordson company, will present the paper, "Plasma Applications for Wafer Level Packaging, Part 1," at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.
Dr. Jiangang (Jack) Zhao will discuss typical plasma applications that enable or improve process steps for wafer-level packaging (WLP) and present original data. As shown by the results, plasma treatment is the recommended process to improve interface adhesion and reduce the current leakage in WLP, as well as oxide removal from surfaces, avoiding micro-voids between the WLP layers.
"The first-hand data indicate that plasma can be used especially for improving platinum-copper (Pl-Cu) interface adhesion and eliminating possible micro-voids between the Cu seed layer and the electrically plated Cu layer during electroplating," stated Dr. Zhao, applications director and chief scientist, Nordson MARCH. "The use of proper plasma recipes is very important for addressing the challenges of these WLP applications."
A globally recognized expert in plasma technologies and author of numerous plasma studies, Dr. Zhao has worked for Nordson MARCH since 2001. He holds a doctorate in chemical engineering from the University of Missouri-Columbia and has worked in the plasma application field for 25 years and the IC packaging and coating industries for 20 years. Dr. Zhao is also an adjunct professor of Donghua University in China.
Other plasma treatments to be discussed in this paper include TSV cleaning, EMC removal from solder balls on wafer, and wafer-on-frame treatment. The presentation will be held during the ICEPT technical sessions in the Hong Kong Science Park, Shatin, Hong Kong, China.
About Nordson MARCH
Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems that improve product reliability and increase production yields. Delivering over 30 years of continuous innovation Nordson MARCH is a global leader in plasma processing technology for manufacturing semiconductors, printed circuit boards, microelectronics, and medical devices with offices and labs worldwide, including the USA, Europe, Singapore, China, Japan, and Korea. An expert staff of scientists and engineers is available to assist development of plasma processes.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, test and inspect for quality, and treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. For moreinformation, visit www.nordsonmarch.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.