Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Trouble in Your Tank: Can You Drill the Perfect Hole?
It’s Only Common Sense: Your Guide to Better Time Management
Ray Prasad to Hold IPC Tech Ed Webinar Series on BGA and BTC Assembly
August 12, 2019 | IPCEstimated reading time: 1 minute
With the right design and reflow profile, you are set up to achieve a successful high-yield assembly process. Ray Prasad, Ray Prasad Consultancy Group and IPC Hall of Famer, takes a deep dive into how to achieve low defect rates in his three-part webinar series titled Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly.
The webinar series brings together the latest information on recent/upcoming updates to IPC standards IPC-7095D, Design and Assembly Process Implementation for BGAs; IPC-7093, Design and Assembly Process Implementation of Bottom Termination SMT Components, new revision coming soon; and IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes.
As Chair of the committees developing these standards, Prasad brings critical insight to the importance of the changes to improve industry best practices for assembly.
Key takeaways from the webinar will be:
- How to properly develop profiles for various soldering processes including reflow, wave, vapor phase, laser and selective soldering
- Understand the importance of achieving time above liquidus for selected solder alloys and the impact on common assembly defects
- Overviews of BGA and BTC designs to enable effective high-yield assembly processes
- Areas to investigate when troubleshooting manufacturing issues with BGAs and BTCs
- Deep analysis of critical challenges such as voiding, head-on-pillow, pad cratering and more!
- The live webinar events are scheduled as follows:
- August 27, 1:00 pm–2:00 pm CDT: Free Introduction Webinar
- September 19, 1:00 pm–3:00 pm CDT: Part 1: Focus on Bottom Termination Components
- October 3, 1:00 pm–3:00 pm CDT: Part 2: Focus on Ball Grid Array Challenges
For more information or to register, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.