-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IEEE's Future Directions Programs Target Reliability
August 13, 2019 | Dan Feinberg, Technology Editor, I-Connect007Estimated reading time: 4 minutes
Dan Feinberg speaks with Kathy Grise, IEEE Future Directions senior program director, at the AWE conference recently in San Jose, California. In this excerpt, Dan and Kathy discuss the importance of reliability, blockchain, recruiting younger generations, etc.
Dan Feinberg: Kathy, thank you for taking the time to speak with me today about IEEE. As you know, I’m also involved with the IPC; we’re seeing some things with regard to some standards, perhaps having to be tightened. Reliability has to improve. It used to be that if your cellphone failed after 10,000 hours of use, that was acceptable—you’d get a new cellphone. But if we’re talking about things like autonomous driving, reliability is key.
One of the topics I heard a lot about at IPC APEX EXPO 2019 was reliability. I’m on the IPC Hall of Fame Committee that’s putting together the next senior executive forum, and one topic we’re considering is standards for reliability, etc. IPC standards, of course, are very important to the industry, but I know that IEEE does an awful lot of things on reliability too.
Kathy Grise: From a reliability perspective, I totally agree with you. It’s always been a top-of-mind topic, dating back to the old IBM days where reliability was key in terms of chips and redundancy in chips. But it’s beyond that now.
Feinberg: Yes, well beyond that. Reliability in electronics is now critical to saving lives, not just making phone calls.
Grise: Reliability is really in the mainstream. That’s, I think, the most significant difference as compared to years ago—even our cars today and autonomous driving.
Feinberg: That’s right; it’s coming.
Grise: I have a Tesla. Honestly, I’m still not that confident in it; I won’t do hands-free driving yet. I still have my hands on the wheel and watch the road. It’s not so much the reliability now because there’s a human factor involved that you can’t control.
Feinberg: True. You can’t predict or control what other humans are going to do.
Grise: At IEEE, we’re trying to address the overall connectivity of everything. Because when we started out in Future Directions, I felt like we were very siloed. So, we started out with an initiative on smart grids, such as the electrical power grid and its impacts.
Feinberg: I did not realize that.
Grise: If you look at it again, the same problem set was being addressed but by different people. Then, there was another initiative on cloud computing. They were only focused on the issues regarding cloud computing, but if you looked at both, they were trying to solve the same problems. Coincidentally, people weren’t stepping back enough and saying it affects the same constituency. It goes back to addressing practitioners—the users and consumers. It’s no longer limited to just a finite set of people. Over the last year, we’ve learned that we need to work better together, and that’s where IEEE has tried to break down those barriers. This year, for Future Directions, we have a Blockchain Initiative. Then, there’s the Brain Initiative, which also encompasses some work on blockchain, along with the Digital Reality Initiative and more.
Feinberg: There’s a lot more to blockchain than just cryptocurrency, obviously, but that’s how the public sees it.
Grise: It really drives towards privacy and even ethics and societal implications. It’s a whole new paradigm with blockchain. It’s not just about Bitcoin; it’s about protecting data. That’s where we’ve realized that it’s just not the blockchain effort that we’re working on. For example, we closely partner now with people from the Brain Initiative because a lot of neuroscience, machine interface, etc., might rely on blockchain.
This all goes back to reliability because, in this day and age, there’s no protection nor privacy where they could modify what is real and make it fake, which is very disconcerting. But again, it’s important to bring that human factor in because that’s where we need humans to stand up and say they accept this technology. It’s an enabler, it makes my life easier, but we have to have controls in place and our own personal responsibility. It’s important to have that redundancy as well as both technological and human involvement.
Feinberg: I’ve seen the reemergence of and the tremendous change in IEEE over the last few years.
Grise: And you saw this year how we’re really trying to reach out more to younger generations because we realized that our IEEE membership is aging. Companies’ workforces are aging as well. We need to address and develop the new generations that are coming in.
Feinberg: Thanks, Kathy, and I look forward to keeping up with what IEEE is doing in the coming years.
Grise: Thank you, Dan.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.