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APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
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Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
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I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
July 4, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 3 minutes
This week, U.S. budget proposals, potential tax and spending cuts, and a huge potential increase to the U.S. deficit have dominated U.S. news, as well as the Federal Reserve chairman hinting that they might consider a small decrease in the interest rate in the coming months. European headlines have continued to be dominated by global trade challenges and strategy, as well as the historic heat waves affecting many parts of the country, sparking more discussion around climate change. Hong Kong’s stock market saw a nice surge this week, even as the greater China economy struggles, amidst hope that news of a trade agreement being reached between China and the U.S. will help stabilize things a bit.
For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring.
One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara. The machinations of geopolitics and geoeconomics was on full display in Europe in June, so check out our interview with Alison James about the focus on defense electronics by the Global Electronics Association.
For designers, I highlight NCAB’s Ryan Miller’s latest column on designing for teeny tiny components and the challenges therein. Finally, I round out my top pics this week with Simon Khesin’s latest article on direct imaging, which kicks off with a fun techie throwback comparison—something I always appreciate.
Worldwide Server Market Value Will Reach 366 billion in 2025, Representing a 45% Growth Compared to 2024
Published June 30
If you were skeptical about projected growth numbers for the data server market being pushed ever upward by AI, don’t be. It’s real. International Data Corporation (IDC) Worldwide Quarterly Server Tracker recently announced updated numbers, and while staggering, are not surprising. With 134.1% growth in 2025 Q1 over 2024, the U.S. is still the fastest-growing server market in the world, with China as number two. If you follow the markets (and who doesn’t), this is a quick must-read.
EU Defence Electronics Ecosystem Highlighted in Brussels
Published July 2
As the European Union grapples with its defense needs and the lack of adequate domestic manufacturing capacity to fulfill them, the Global Electronics Association (formerly IPC) in Europe held the IPC–ASD Europe Defense Electronics Summit on June 10 during the same week that the European Defence & Security Summit took place in Brussels. In this I-Connect007 interview, Alison James, senior director of Global Electronics Association—Europe, discusses the purpose of having this summit at this time, and underscores the critical role that European defense has come to occupy since the Russia-Ukraine war, and all of the lessons it has yielded.
Rehm Open House Celebrates 10 Years In Mexico
Published June 30
Luis Garcia of Rehm Thermal Systems, in celebrating the 10th anniversary of their Mexico facility in Guadalajara, recounts how starting a facility in Mexico 10 years ago was a challenging endeavor. With all they’ve accomplished since then, Rehm is positioned well in the era of nearshoring and global trade challenges. Projecting good growth despite global trade barriers, Mr. Rehm visited the Guadalajara plant just this week for a big celebration in Mexico. Luis says all customers are welcome.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Published June 30
This column by Ryan Miller, with assistance from John Piccirilli, goes into some detail as to how designers may be grappling with insanely small components and packaging requirements. “Micro components have redefined what is possible in PCB design, Ryan writes. “With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before.” It’s a topic of conversation that never seems to get old, as we all forge through some of these challenges together. This is a must-read for PCB designers.
Driving Innovation: Direct Imaging vs. Conventional Exposure
Published July 2
I knew I would enjoy Simon Khesin’s latest column when I read the first sentence, “My first camera used Kodak film.” In comparing transformations in imaging in the printed circuit board industry to those of the camera from the 1980s to today, Simon highlights the “higher accuracy” and “better results” a manufacturer can achieve using direct imaging technology and the elimination of phototools.
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Global Sourcing Spotlight: The New Landscape of Manufacturing
02/11/2026 | Bob Duke -- Column: Global Sourcing SpotlightFor decades, manufacturing followed a familiar pattern: design in the West, production in China, and distribution elsewhere. That map no longer works. The shocks of the past five years—the pandemic shutdowns, trade wars, logistics meltdowns, and geopolitical uncertainty—have redrawn the boundaries of global manufacturing. The question every OEM is asking isn’t “How cheap can we make it”? but “How certain are we that we can obtain it?” We are witnessing a seismic shift in the landscape of making things. The work hasn’t disappeared; it’s just moving.
PEDC: Built for the Design Community by the Design Community
02/05/2026 | Peter Tranitz, Global Electronics AssociationThe Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.
Latest SMT007 Magazine Previews APEX EXPO 2026: Bigger and Better Than Ever
02/04/2026 | I-Connect007 Editorial TeamAPEX EXPO 2026 is coming soon, and it is bigger and better than ever. In the February issue of SMT007 Magazine, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year. Consider this your passport to where the electronics manufacturing industry is headed in 2026.
Lisa Anderson Highlights Greenland’s Strategic Importance to Global Supply Chains
02/03/2026 | LMA Consulting Group, Inc.Lisa Anderson, MBA, CSCP, CLTD, a leading expert in manufacturing strategy and supply chain transformation and president of LMA Consulting Group, Inc., is drawing attention to the growing importance of Greenland and its role in safeguarding global supply chains in an increasingly volatile environment.
SEMI Sets 2026 U.S. Policy Priorities for the Semiconductor Industry
01/29/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced its 2026 U.S. Policy Strategy: Securing the Semiconductor Supply Chain to Enable American AI Leadership designed to strengthen U.S. competitiveness, sustain long-term market investment, and support innovation across the full semiconductor ecosystem.