Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
iNEMI Publishes Product Sector Chapters from the 2019 Roadmap
August 13, 2019 | iNEMIEstimated reading time: 2 minutes
The International Electronics Manufacturing Initiative (iNEMI) today announced release of four of the seven Product Emulator Group (PEG) chapters of the 2019 Roadmap. The following PEG chapters are now available online:
- Aerospace & Defense
- High-End Systems
- Industrial Internet of Things (IIoT)
- Medical
The remaining PEG chapters — Automotive, Office & Consumer and Portable & Wireless — will be published in one of the later waves.
The PEG chapters define product requirements for specific market sectors, anticipating technology and business-related needs over a 10-year horizon. These needs include everything from cost targets to test requirements to specific technology attributes.
Discussion of these needs includes a key attributes spreadsheet for most sectors (the IIoT chapter is an exception as IIoT is a key enabler for all the other markets). These PEG chapters were developed by industry subject matter experts from the specific sector covered. Additional reviews and input were gathered for a broad-based view of that emulator’s scope.
New this year is the Industrial Internet of Things chapter. It discusses key aspects of the IIoT infrastructure, a network connected by communications technologies that results in systems that can monitor, collect, exchange, analyze, and deliver valuable new actionable insights. The chapter presents market predictions around IIOT, details the technological advancements needed and the challenges that must be overcome in the electronics manufacturing industry to fully realize the benefits, plus it offers recommendations for a successful conversion to Industry 4.0.
Product Sector Trends
The 2019 PEG chapters offer current market information for each of the product sectors, such as market trends, influencers, and an informed forecast of the product characteristics at the electronic component level as it pertains to each market sector through 2029. These chapters also include in-depth analysis of the challenges facing each market to sustain profitability and growth.
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. The consortium is made up of more than 90 manufacturers, suppliers, industry associations and consortia, government agencies, research institutes and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, executes collaborative projects to eliminate these gaps (both business and technical) and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Morrisville, North Carolina. For additional information about iNEMI, visit http://www.inemi.org.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.