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Discover TRI's Micro SMD Test and Inspection Solutions at SEMICON Taiwan 2019
August 19, 2019 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will be featuring the Test and Inspection solutions for semiconductor packaging production lines at SEMICON Taiwan 2019. Visit TRI at booth # J3042 to discover high-precision inspection for the semiconductor industry at Taipei Nangang Exhibition Center Hall 1.
Test Research, Inc. is introducing the new TR7700QE-S 3D AOI, designed for the Semiconductor & Packaging Industry, with ultra-high resolution at 1.85 μm. TRI will also feature the Global Technology Award-winning TR7007Q 3D SPI with Quad digital fringe projectors for Shadow-free High Precision Inspection.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions, and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
Discover TRI's Advanced Packaging Test and Inspection solutions at SEMICON Taiwan 2019.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzer (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw.
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