-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MIRTEC to Demo Latest 3D AOI, SPI Systems at SMTAI
August 20, 2019 | MirtecEstimated reading time: 2 minutes

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in booth #305 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI systems at the two-day event.
“We at MIRTEC are very excited to present what are unquestionably the Inspection Industry’s most Technologically Advanced 3D AOI and 3D SPII Systems at SMTAI 2019,” said Brian D’Amico, president of MIRTEC’s North American sales and service division.
The all new MV-6 OMNI 3D AOI machine combines MIRTEC’s exclusive 15-megapixel CoaXPress camera technology with their proprietary OMNI-VISION 3D digital Tri-Frequency Moiré technology to provide precision inspection of SMT devices on finished PCB assemblies.
MIRTEC’s exclusive 15-megapixel CoaXPress camera system is designed and manufactured by MIRTEC for use with its complete product range of inspection equipment.
MIRTEC’s proprietary digital Tri-Frequency Moiré technology provides superior 3D inspection of SMT and through-hole devices up to 25 mm tall. This industry-acclaimed technology yields precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-6 OMNI machines feature four 10-megapixel side-view cameras in addition to the 15-megapixel top-down camera. There is little doubt that this new technology has set the standard by which all other inspection equipment are measured.
MIRTEC’s award-winning MS-11e 3D SPI machine is configured with an exclusive 15-megapixel CoaXPress camera system, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.
The MS-11e uses dual-projection shadow-free Moiré phase shift imaging technology to inspect solder paste depositions on PCBs post screen-print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.
MIRTEC’s total quality management system software, INTELLISYS also will be on display at SMTA International. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.
“MIRTEC has earned a solid reputation in the Electronics Manufacturing Industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico. “We look forward to welcoming visitors to our booth during the two-day event.”
About MIRTEC
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).