Raytheon-Built Space Sensor Will Fly Aboard NASA Satellite to Measure Coastal and Ocean Ecosystems
August 26, 2019 | PRNewswireEstimated reading time: 1 minute
Raytheon will build the Geostationary Littoral Imaging and Monitoring Radiometer, or GLIMR, sensor, under a contract from the University of New Hampshire. GLIMR, NASA's selected Earth Venture Instrument-5 investigation, will be NASA's first hyperspectral imager in geostationary, or GEO, orbit. Hyperspectral imaging collects and processes information from across the electromagnetic spectrum including visible light, infrared and ultraviolet frequencies to create a highly detailed view of physical and biological conditions in coastal waters.
The instrument will provide high-sensitivity, high-spatial and high-temporal resolution measurements of coastal and ocean ecosystems in the Gulf of Mexico, parts of the southeastern U.S. coastline and the Amazon River plume. Decision-makers will use the GLIMR data to respond rapidly to natural and manmade coastal water disasters, such as harmful algae blooms and oil spills. It will also help improve the coastal ecosystem's sustainability and resource management.
"GLIMR will collect the sharpest and most colorful view of physical and biological conditions in coastal waters ever seen from GEO," said Jeff Puschell, GLIMR instrument scientist and principal engineering fellow at Raytheon Space Systems. "A hyperspectral imager is essential technology to capture new insight about our changing coastal ecosystems."
The University of New Hampshire is NASA's lead organization for the GLIMR contract. The instrument will launch aboard its host spacecraft in the 2026-2027 timeframe. Its data will be available to scientists, researchers and educators around the world.
About Raytheon
Raytheon Company, with 2018 sales of $27 billion and 67,000 employees, is a technology and innovation leader specializing in defense, civil government and cybersecurity solutions. With a history of innovation spanning 97 years, Raytheon provides state-of-the-art electronics, mission systems integration, C5I products and services, sensing, effects, and mission support for customers in more than 80 countries. Raytheon is headquartered in Waltham, Mass.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.