-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
TopLine Urges Defense Contractors to Take Control of FPGA Column Attachment
August 26, 2019 | TopLineEstimated reading time: 1 minute
TopLine Corporation, a producer of components for ruggedized semiconductors, urges defense contractors to plan for delivery delays of critical military components, specifically field programmable gate array (FPGA) devices, in the event FPGA makers suddenly cannot provide FPGAs with solder columns.
"The defense industry should be concerned about its dependency on a single source vendor to attach copper-wrapped solder columns to FPGA devices as recorded in the Qualified Manufacturer List (QML-38535) published by an agency of the Department of Defense. Military-grade FPGA devices used for defense applications cannot function without solder columns," states TopLine CEO Martin Hart. "Defense contractors are better served by bringing control of attaching such solder columns in house rather relying on the current single-source subcontractor to provide this service. Delivery of warfighters and aviation systems may be interrupted without solder columns to connect FPGA components to printed circuit boards (PCBs)," said Hart.
"TopLine is a national resource as an American manufacturer of copper-wrapped solder columns. We can fully support defense contractors who want to take full control of attaching copper-wrapped columns on FPGA devices by themselves. Defense contractors with in house capability to attach solder columns can have FPGA devices ready in days rather than waiting for months. The current monopoly supplier has no incentive to deliver column attachment services quickly because no competition exists,” adds Hart.
Hart suggests that major customers of FPGA devices such as Boeing, L-3 Harris, Lockheed Martin, Northrop-Grumman and Raytheon, would all benefit by developing their own internal capability to attach solder columns as the last step in getting FPGA devices to be PCB ready.
"The U.S. industrial base benefits by executing a risk mitigation strategy to take control of solder column attachment to ensure a resilient capability to produce critically needed FPGA components. By acting now to qualify their column attachment process, defense contractors can reduce the risk of a future FPGA shortage instead of waiting for a sudden disaster to strike, potentially costing hundreds of millions of dollars in delays,” concludes Hart.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.