-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TopLine Urges Defense Contractors to Take Control of FPGA Column Attachment
August 26, 2019 | TopLineEstimated reading time: 1 minute
TopLine Corporation, a producer of components for ruggedized semiconductors, urges defense contractors to plan for delivery delays of critical military components, specifically field programmable gate array (FPGA) devices, in the event FPGA makers suddenly cannot provide FPGAs with solder columns.
"The defense industry should be concerned about its dependency on a single source vendor to attach copper-wrapped solder columns to FPGA devices as recorded in the Qualified Manufacturer List (QML-38535) published by an agency of the Department of Defense. Military-grade FPGA devices used for defense applications cannot function without solder columns," states TopLine CEO Martin Hart. "Defense contractors are better served by bringing control of attaching such solder columns in house rather relying on the current single-source subcontractor to provide this service. Delivery of warfighters and aviation systems may be interrupted without solder columns to connect FPGA components to printed circuit boards (PCBs)," said Hart.
"TopLine is a national resource as an American manufacturer of copper-wrapped solder columns. We can fully support defense contractors who want to take full control of attaching copper-wrapped columns on FPGA devices by themselves. Defense contractors with in house capability to attach solder columns can have FPGA devices ready in days rather than waiting for months. The current monopoly supplier has no incentive to deliver column attachment services quickly because no competition exists,” adds Hart.
Hart suggests that major customers of FPGA devices such as Boeing, L-3 Harris, Lockheed Martin, Northrop-Grumman and Raytheon, would all benefit by developing their own internal capability to attach solder columns as the last step in getting FPGA devices to be PCB ready.
"The U.S. industrial base benefits by executing a risk mitigation strategy to take control of solder column attachment to ensure a resilient capability to produce critically needed FPGA components. By acting now to qualify their column attachment process, defense contractors can reduce the risk of a future FPGA shortage instead of waiting for a sudden disaster to strike, potentially costing hundreds of millions of dollars in delays,” concludes Hart.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.