The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Murray Percival Company to Support MIRTEC’s AOI at SMTAI
August 26, 2019 | Murray Percival CompanyEstimated reading time: 1 minute
Murray Percival Company, the leading supplier to the Midwest's electronics industry, is pleased to announce that they will be available to demo the MIRTEC MV-6 OMNI 3D AOI machine* at booth #305 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois.
The all new MV-6 OMNI 3D AOI machine combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress camera technology with their proprietary OMNI-VISION® 3D Digital Tri-Frequency moiré technology to provide precision inspection of SMT devices on finished PCB assemblies.
MIRTEC’s exclusive 15 Mega Pixel CoaXPress camera system is designed and manufactured by MIRTEC for use with its complete product range of inspection equipment.
MIRTEC’s proprietary Digital Tri-Frequency moiré technology, provides superior 3D inspection of SMT and through-hole devices up to 25mm tall. This industry acclaimed technology yields precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel side-view cameras in addition to the 15 Mega Pixel top-down camera. There is little doubt that this new technology has set the standard by which all other inspection equipment are measured.
About Murray Percival
The Murray Percival Company is a third-generation family owned business that was founded in January of 1960. They are currently the leading supplier to the Midwest's electronics industry, offering thousands of capital and distribution products as well as being the industry’s leading process enabler. www.murraypercival.com
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.