-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young America to Highlight 3D Inspection Solutions for the Smart Factory at SMTAI
August 27, 2019 | Koh Young AmericaEstimated reading time: 2 minutes

Koh Young America will highlight its industry-leading Full 3D inspection solutions and next-generation closed-loop Koh Young Process Optimizer (KPO) at SMTA International on September 24-25 in Rosemont, Illinois. The company cordially invites show and conference attendees to visit booth 609 and learn how industry-leading 3D measurement systems and closed-loop process solutions from Koh Young America can help improve production throughput and yield.
At the show, Koh Young America will demonstrate the industry’s fastest true 3D measurement and inspection solution. The 8030-3 Solder Paste Inspection (SPI) solution and analytics to eliminate false calls and boost throughput. We will also highlight our flagship aSPIre3 with a feature set suitable for myriad challenges in demanding production environments in-line at booth 823 with Fuji America. These systems continue to raise the benchmark standards in the industry.
The award-winning Koh Young Zenith Automated Optical Inspection (AOI) solution will complement the revolutionary SPI equipment. Consisting of multiple models targeting different production needs, Koh Young will highlight the Zenith platform – the world’s best-selling and first True 3D AOI. The hardware technology and measurement algorithms within the Zenith series work together to identify defect sources and provide accurate inspection of components, joints, and more, regardless of the model.
Using its world-class 3D AOI measurement technology as the foundation, Koh Young designed the KY-P3 to overcome longstanding industry challenges with automated pin inspection. Combining its advanced high-resolution optics with innovative vision algorithms, the Koh Young KY-P3 provides accurate pin inspection for single pin, array, forked, press-fit, and other pin arrangements. Following its vision to “Measure Everything, Everywhere,” the new Koh Young KY-P3 delivers true 3D inspection capabilities for automotive, industrial, and other verticals, including backplanes and connector assembly processes.
Smart Factory Solution
Koh Young is leading the effort to harness the power of connectivity and create a smart factory. For instance, its Koh Young Process Optimizer (KPO), which is using AI-powered machine learning, includes interlinking software modules that exercise complex algorithms to develop closed-loop process recommendations. The Machine-to-Machine (M2M) connectivity drives the smart factory vision one step further by enabling automatic SMT line adjustments. Finally, working with its printer and mounter partners, Koh Young has developed the connectivity
tools to connect with multiple suppliers and simplify communication across the entire PCBA line. In fact, Koh Young was named one of the 10 Most Innovative Smart Factory Solution Providers to Watch in 2019 and earned a position in “Headlines 500”, an annual list of the fastest-growing U.S. companies. As the recognized leader in electronics measurement and inspection, Koh Young continues to expand its capabilities to solve industry challenges and improve the measurement industry.
If you cannot attend SMTA International and visit us in Booth 609, you can learn more about Koh Young and its best-in-class inspection solutions at www.kohyoung.com.
About Koh Young
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure it sustains a close relationship with its growing customer base, while providing them with access to a global network of inspection and measurement experts.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.