Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
SEHO to Exhibit with Bergen Systems Pvt. Ltd. at productronica India
August 27, 2019 | SEHO Systems GmbHEstimated reading time: 1 minute
SEHO Systems GmbH will exhibit at productronica India, scheduled to take place Sept. 25-27, 2019 at the India Exposition Mart Limited in Greater Noida, India. SEHO will display the new StartSelective soldering system in Hall No 15, Booth PE27 with its representative Bergen Systems Pvt. Ltd.
SEHO constantly develops its range of soldering solutions and will introduce the new StartSelective – the perfect plug-and-produce selective soldering system for those just entering into automated soldering.
The StartSelective is thought through down to the last detail, from its compact design, ease of operation and many technical highlights. With a footprint of only 2.5 m², the StartSelective provides maximum quality and reproducibility of soldering results for assemblies up to 20" x 20" and an outstanding return on investment.
While all process steps are fully automated and monitored, loading and unloading of assemblies is done manually.
The bottom-side preheat section of the StartSelective is equipped with pulsar heaters over the full area, which can be activated individually depending on board dimensions. Pulsar heaters feature a high energy density and quick reaction time. This enables a remarkable reduction in energy consumption.
An additional top-side IR preheating ensures permanent and controlled heat support during long cycles.
Another highlight is the optimized soldering area with non-wetted mini-wave solder nozzles, featuring a 7° soldering angle. The nozzles convince with stable and reproducible flow properties, resulting in outstanding soldering quality. Even difficult geometries can be soldered easily. Moreover, non-wetted solder nozzles are maintenance-free and feature a nearly unlimited lifetime, thus avoiding follow-up costs.
Just like the high-volume selective soldering systems from SEHO, the StartSelective is equipped with a complete package for automated process control. The system is designed for maximum efficiency. Programming is 100 percent offline at any PC workplace so that the machine is always available for production.
All setup, retooling and maintenance are easily accessible on one side of the machine. This design allows users to integrate the StartSelective in any production island with minimum footprint requirements, or to place it as stand-alone system in the corner of the production floor.
For more information, meet the SEHO team at productronica India in hall 15 booth PE27, or visit www.seho.de.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.