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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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Ventec Expands Thermal Interface Materials RangeAugust 29, 2019 | Ventec
Estimated reading time: 2 minutes
Ventec International Group Co., Ltd., a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce the addition of two new thermally conductive thin isolation foil materials to its range of Thermal Interface Materials (TIM) under its distribution agreement with EMI Thermal.
Initially for the European market, Ventec teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) that are a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s. The range of materials distributed through Ventec, which includes double sided thermal tape, electrical insulators, natural graphite and void fillers, has now been expanded with the addition of two new UL94 V-0-recognized thin isolation/thermal conductive foil materials.
T-P INS 2 and T-P INS 3 A0/A1 are high-performance electrically insulating, thermally conductive interface materials that offer thermal conductivity of 1.8-3W/mK. Further features include high tensile strength (≥0.8-1.0) designed to prevent cut through and electrical shorts, low thermal impedance (0.16˚C in2/W), no viscosity and a thickness of 0.18-0.30mm, making them the ideal material choice for access control, computer and network & communications applications including SMPS, telecom devices, visual devices, networking products, LCD-TV, notebook PC’s, PC’s, etc. Full material specifications can be found at http://www.ventec-group.com/products/thermal-interface-material/.
To offer even greater value to customers, Ventec continues to maintain and build upon its one-stop-service solution for PCB materials to the European PCB and electronics industry, by offering a range of third party products that complement its own extensive product range, including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and specialty (Centrum & Glossback) drill materials, copper foils including ACF.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.