-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm to Exhibit at Bondexpo in Stuttgart in September
August 29, 2019 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Bondexpo is regarded as a leading trade fair for bonding technology and is an important venue for companies involved in industrial dispension and attaching. Over 50 exhibitors will be present at the Stuttgart trade fair site between 7 and 10 October, among them Rehm Thermal Systems with its product portfolio covering the fields of dispensing, adhesive technology and application processes. This includes the innovative systems of the Protecto-X series. Come and see for yourself – at the Rehm stand in Hall 6, 6513.
As a global manufacturer and supplier of a wide range of application processes for dispension and attaching technology, Rehm Thermal Systems is able to present its customers particularly versatile and process-reliable solutions. This year for the first time, Rehm is appearing at Bondexpo, the leading fair for all matters connected with adhesive technology. ‘As a leading global fair, Bondexpo is thought of as one of the foremost important meeting points for the industry. We can see that our international customers are looking for our new technologies and our global support, and so we have taken the decision to appear at Bondexpo this year’, states Michael Hanke, chief sales officer at Rehm. ‘With the diverse opportunities available to us for global networking in manufacturing – say via MES or ERP systems – we can provide our customers with the right technologies and the systems specific to their needs. This includes the ProtectoX series of bonding and dispensing systems’, adds Hanke.
The Protecto systems extend reliable, automated processes and precision results in the application of a wide range of materials. With solid machine engineering and diverse applications, Protecto is a strong contender in the fields of dispensing and adhesive technology. Up to 4 applicators can be used simultaneously, allowing the operator a wide range of options. In addition to dispensing, the ProtectoX series also offers the possibility of creating freely definable housing shapes in the third dimension. ProtectoX systems allow immediate hardening of UV lacquers, while various materials can also be cast or bonded. The systems are also designed to afford dependable surface activation and cleaning using plasma. ‘Rehm has supplied complete, innovative thermal system solutions for years, and we are delighted to be able to present all this at Bondexpo’, declares Michael Hanke.
About Rehm Thermal Systems
As a specialist in thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in modern, economically viable production of electronics assemblies. A globally active manufacturer of reflow soldering systems based on convection, condensation or vacuum, plus drying and coating systems, function testing systems, metallisation equipment for solar cells and numerous special and custom systems, we have a presence in all the relevant growth markets. As a partner with almost 30 years of industry experience, we create innovative production solutions that set standards.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).