Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Murray Percival to Represent Ersa Advanced Soldering Solutions at SMTAI
August 29, 2019 | Murray Percival CompanyEstimated reading time: 1 minute
Murray Percival Company has announced that they will be available to demo the Ersa VERSAFLOW 3/45, HR550, i-CON VARIO 4 Station, and Ersa Mobile Scope at booth #424 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois.
The Ersa VERSAFLOW 3/45 selective soldering system is based on a modular platform in order to satisfy all demands in regard to flexibility. Depending on the application and on the throughput requirements called for, additional flux, preheat and solder modules can be integrated into the system. In the maximum configuration level of the VERSAFLOW, the system can therefore operate with up to three solder modules, and each of these modules can again be configured with two mini-wave solder baths. In total, up to 6 mini-wave solder bath can be installed in a system, and each solder module can be preceded by a preheat unit.
Also at the show will be the HR 550 guided rework system, with a highly efficient 1500W hybrid heating head, highly accurate placement with integrated force sensor and large-area IR bottom heading in 3 zones. Also available for demos and education will be the i-CON VARIO 4 an electronically temperature-controlled multichannel soldering and desoldering station and the Ersa Mobile Scope. The Ersa Mobile Scope is a hand-operated inspection system for fast inspection of hidden solder joints.
Ersa Mobile Scope is available through Murray Percival in MI, OH, IN, KY, and W.PA.
About Murray Percival
Murray Percival Company is a third-generation family owned business that was founded in January of 1960. They are currently the leading supplier to the Midwest's electronics industry, offering thousands of capital and distribution products as well as the industry’s leading process enabler. www.murraypercival.com
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.