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Imec, Partners Unveil SWIR Sensor with Lead-free Quantum Dot Photodiodes

12/31/2024 | Imec
At the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and its partners in the Belgian project Q-COMIRSE, present a first of its kind prototype shortwave infrared image sensor with indium arsenide quantum dot photodiodes.

L3Harris Equips New German H145M Helicopters with High-Performance Imaging Capabilities

12/10/2024 | L3Harris Technologies
L3Harris Technologies is providing WESCAM MX™-15D electro-optical/infrared sensor systems to Airbus Helicopters for the German armed forces and its new fleet of multi-role H145M helicopters.

QinetiQ US Awarded $42M Task Order to Support U.S. Army Advanced Sensor Processing and Imaging Technologies

12/02/2024 | QinetiQ
QinetiQ US has been awarded a four-year, $42 million task order to support the U.S. Army Combat Capabilities Development Command (DEVCOM) C5ISR Center's Research & Technology Integration (RTI) Directorate.

Teledyne's Detector Enables NASA's Europa Clipper MISE Instrument

10/21/2024 | Teledyne
Teledyne Technologies Incorporated is pleased to announce its contribution to NASA's successful Europa Clipper launch, which took place at NASA's Kennedy Space Center.

Connect the Dots: Designing for Reality—Outer Layer Imaging

09/26/2024 | Matt Stevenson -- Column: Connect the Dots
Welcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
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