Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Ascentech to Exhibit at SMTAI
September 4, 2019 | Ascentech, LLCEstimated reading time: 1 minute
Ascentech LLC will be exhibiting GEN3 Systems’ most recent enhancements to its already popular AutoSIR2+ (Surface Insulation Resistance) and AutoCAF2+ (Conductor Anodic Filament) test equipment at SMTAI 2019 in booth #1016. Ever-increasing demands for higher voltage testing capability, longer test durations, and the capability for simultaneous testing are met by the GEN3 Systems’AutoSIR2+ and AutoCAF2+ testers, whose features include totally revised software for both instruments; the ability to simultaneously run 3 different bias voltages; high Voltage CAF Testing to 1,250V (specific controlled applications); and more.
Also, the popular GEN3 Gensonic Stencil Cleaner will be on display. Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
Ascentech will also exhibit the complete line of industrial inspection cameras, plus their new updated Pro-X software suite. INSPECTIS’ Pro-X is an easy-to-use software developed for viewing live images and capturing still images and video from the full range of Inspectis HD, Full HD and 4K digital microscopes. In addition to image view and capture features, Inspectis software provides powerful tools for calibration of device magnification, geometrical measurements, live image overlays and annotations on still images.
About Ascentech, LLC
Ascentech, LLC is a technology and solutions provider and distributor to the electronics manufacturing and assembly industry with nearly 20 years’ experience. Ascentech is the North American Distributor for Inspectis Optical Systems AB, well as GEN3 Systems, and also supplies the industry with other testing and process optimization solutions for electronics manufacturing. To learn more, visit www.ascentechllc.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.