Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Posters Sought for IPC APEX EXPO 2020
September 5, 2019 | IPCEstimated reading time: Less than a minute
IPC is inviting the industry to submit technical posters for the upcoming IPC APEX EXPO 2020. Delivering a technical poster at the industry's premier conference on electronics manufacturing provides significant visibility for you and your company on your research and knowledge.
Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the global electronics industry. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, February 5, offering additional visibility.
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
The deadline for submission of abstracts is November 15, 2019.
To submit posters, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Ynvisible Celebrates Inauguration of New Production Facility in Norrköping, Sweden
09/09/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a pioneer in sustainable and scalable e-paper display technology and printed electronics, is pleased to announce the successful inauguration of its new roll-to-roll production facility in Norrköping, Sweden – a city globally recognized as a center of excellence for Printed and Organic Electronics.
Sypris Wins Contract for Classified Missile Avionics Program
09/09/2025 | Sypris Solutions Inc.Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on contract award to manufacture and test advanced electronic power supply modules for integration into the avionics suite of a classified, mission-critical missile program. Production is scheduled to begin in 2026.
Safran, PGZ Reinforce Defense Partnership Through Innovation and Local Industrial Cooperation
09/08/2025 | SafranSafran Electronics & Defense, a leading European high-technology company in aerospace and defense, and Polska Grupa Zbrojeniowa S.A. (PGZ), Poland’s primary defense industry leader, have signed two Memorandums of Understanding (MoU) to further expand their collaboration in support of European security and industrial cooperation during the International Defense Industry Exhibition (MSPO) held in Kielce.