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MacDermid Alpha to Present Five Technology Papers at SMTAI 2019
September 6, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, leaders in the production of specialty chemistries, electronic soldering and bonding materials, will be presenting five technical papers during the SMTA International Conference to be held September 22 – 26, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois.
The Circuitry Division will present two papers on Wednesday, September 25. As part of the Metallization Technology track, Carmichael Gugliotti, Applications Specialist, will present “Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity” at 11:00 am in Room 45. Lenora Clark, Director, OEM Applications, will present “How Advanced Safety Systems Change Automotive PCB Design and Build” at 1:30 pm in Room 45.
The Assembly Division will present three papers with a focus on solder reliability on Thursday, September 26. Ranjit Pandher, Senior Manager, LED and Semiconductor Materials, will present “High Reliability Lead-Free Solder for Low-Cost Die Attach Applications”, as part of the Advanced Packing Technology track at 8:00 am in Room 48. Anna Lifton, will present two papers, as part of the Lead-Free Soldering Technology track, “High Reliability Low-Temperature Solder Alloys” at 1:00 pm, followed by “Reliability of the Solder Joints: Is a Shear Force a Good Indicator” at 3:30 pm, both in Room 45. “We continue to advance the performance of our solder materials to meet our customers’ demands for high reliability and performance,” said Anna Lifton, Assembly Division Research and Development Manager.
For more information on MacDermid Alpha’s innovative technology, please visit us at macdermidalpha.com. For the times and locations for these papers, please visit SMTA International at smta.org/smtai/.
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