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Foxconn's Board Of Directors' Office Held an Expanded Summer Internship Program; Acceptance Rate at 1.7%

06/12/2025 | Foxconn
The results of the 2025 summer internship selection of the board of directors of Hon Hai Technology Group , the world's largest technology manufacturing platform service provider, are out.

Compal Posts Sales Report for May 2025

06/12/2025 | Compal Electronics Inc.
Compal Electronics reported May 2025 consolidated revenue of NT$ 57,625mn, representing MoM decrease of 7.5% and YoY decrease of 25.4%. The accumulated revenue of 2025 was NT$319,021mn, representing YoY decrease of 9.9%.

Delta Thailand Hosts BOI Delegation and U.S. Media to Showcase Thailand’s Electronics Industry Ecosystem

06/12/2025 | Delta Thailand
Delta Electronics (Thailand) Public Company Limited recently welcomed a delegation of U.S.-based media professionals and representatives from the Thailand Board of Investment (BOI) Office in New York on May 14 , 2025, at Delta Plant 5 headquarters in Bangpoo, Thailand, as part of a strategic initiative to highlight the strengths of Thailand’s growing electronics sector.

Neways, BAE Systems Hägglunds Sign Long-term Supplier Agreement

06/12/2025 | Neways
By signing the LTSA, Neways and BAE Systems Hägglunds further cement the long-time collaboration that started more than 15 years ago when Neways first supported BAE Systems in delivering an early fleet of CV90 armored vehicles: a platform that has been ordered in over 1,900 vehicles globally.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
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