Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
MacDermid Alpha‘s Assembly Division to Present Void Reduction Solutions at the FED Conference
September 9, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present on the topic of Void Reduction at the FED Conference which runs from 26-27 September in Bremen, Germany.
Ralph Christ, customer technical support manager DACH Region for MacDermid Alpha will present "Voiding in Solder Joints: Identifying Causes and Potential Actions Against Void Formation" on Thursday 26 September, 15.30 at the event. "Voids are a major concern for electronic assembly manufacturers as voiding often compromises the reliability of an assembly," comments Ralph. "To combat voiding a combination of process expertise to understand critical process parameters, design factors and equipment information and innovative products such as solder paste, solder preforms and stencil design is needed."
ALPHA Void Reduction Solutions is a proven methodology to address all types of voiding issues in SMT assembly. Alpha experts analyze a customer’s process and develop an engineered recommendation addressing material sets, equipment settings and stencil design strategies to produce the desired voiding levels.
MacDermid Alpha Automotive will also present at the conference. Jan-Henryk Serzisko, strategic account director for MacDermid Alpha Automotive will present "Formable Electronics: Process Requirements and Materials for IMSE" on Friday 27 September at 15:00.
To register for the event please visit the FED Conference website. To learn more about ALPHA Void Reduction Solutions and ALPHA Products for Formable Electronics visit www.macdermidalpha.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.