Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
MacDermid Alpha‘s Assembly Division to Present Void Reduction Solutions at the FED Conference
September 9, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present on the topic of Void Reduction at the FED Conference which runs from 26-27 September in Bremen, Germany.
Ralph Christ, customer technical support manager DACH Region for MacDermid Alpha will present "Voiding in Solder Joints: Identifying Causes and Potential Actions Against Void Formation" on Thursday 26 September, 15.30 at the event. "Voids are a major concern for electronic assembly manufacturers as voiding often compromises the reliability of an assembly," comments Ralph. "To combat voiding a combination of process expertise to understand critical process parameters, design factors and equipment information and innovative products such as solder paste, solder preforms and stencil design is needed."
ALPHA Void Reduction Solutions is a proven methodology to address all types of voiding issues in SMT assembly. Alpha experts analyze a customer’s process and develop an engineered recommendation addressing material sets, equipment settings and stencil design strategies to produce the desired voiding levels.
MacDermid Alpha Automotive will also present at the conference. Jan-Henryk Serzisko, strategic account director for MacDermid Alpha Automotive will present "Formable Electronics: Process Requirements and Materials for IMSE" on Friday 27 September at 15:00.
To register for the event please visit the FED Conference website. To learn more about ALPHA Void Reduction Solutions and ALPHA Products for Formable Electronics visit www.macdermidalpha.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.