New Mixing Technology Achieves More Explosive Power
September 11, 2019 | BAE SystemsEstimated reading time: 1 minute

Our engineers have achieved a 20% increase in munition explosive power by mixing current polymer bonded explosives using resonant acoustic mixing (RAM) technology.
This has potential benefits for a range of products in advanced warheads as well as general artillery.
Lee Smurthwaite, Munitions Delivery Director at BAE Systems Land UK, explained: “This new explosive process means we can add 20 percent more power to existing product lines – both warheads and shells. Thinking about future designs, this means less explosive can be used to achieve the same effect, reducing both space and weight. You could use this space to install more tracking hardware to increase precision, or increase the amount of propellant to add speed and range.
“The defence industry is currently developing a new generation of advanced missiles, so our use of this technology could really push the boundaries of what’s possible.”
RAM has enabled us to make changes to the explosive formula that would not be possible using a traditional ‘bladed’ mixing process. As well as increased power, RAM brings a number of other benefits, including a significant reduction in mixing time and waste generated.
The next step is to increase the RAM capacity in our dedicated munitions facility in Glascoed, South Wales, so that it can start producing RAM munitions at scale. Additionally, the facility will be used to develop new forms of explosive designed for the next generation of advanced munitions.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.