-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
TRI Brings Test and Inspection Solutions to SMTA Guadalajara 2019
September 12, 2019 | TRIEstimated reading time: 1 minute

Test Research, Inc. (TRI) will join SMTA Guadalajara 2019 to showcase its test solutions and inspection solutions for the SMT industry. Visit the TRI/SMT Integration Booth at Expo Guadalajara in booth #613 from October 23−24, 2019 to learn more about the latest innovations in 3D SPI, 3D AOI, 3D CT AXI, and multicore ICT.
TRI’s 2019 lineup features the industry-leading 3D AOI TR7500QE equipped with five cameras for multi-angle inspection, digital fringe pattern projectors and a 3D laser module for inspecting reflective surfaces. TRI will also feature the leading 3D SPI TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control. TRI solutions are Smart Factory Ready, as they support the latest M2M Connection protocols, such as the IPC-Hermes-9852 standard.
TRI is celebrating its 30th anniversary as a leading test and inspection solutions provider for the electronics manufacturing industry. Join us at SMTA Guadalajara 2019 booth #613 for a personal demonstration of TRI's world-class test and inspection solutions lineup.
About TRI
TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated X-ray inspection (AXI) systems to manufacturing defect analyzers (MDAs), functional testers (FCT) and in-circuit testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.
About SMT Integration
SMT Integration provides innovative solutions for the SMT and process handling equipment industry. SMT Integration is TRI’s partner in Mexico. For more information, please visit https://www.smtintegration.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.