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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Atotech to Present at the SEMICON Taiwan 2019 in Taipei
September 16, 2019 | AtotechEstimated reading time: 1 minute
Atotech, a global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, is pleased to announce its participation in this year’s SEMICON Taiwan. The exhibition will be held at the Taipei Nangang Exhibition Center from September 18 – 20.
SEMICON Taiwan is an important platform that connects Taiwan and global microelectronics ecosystems, and also provides a bridge that facilitates smooth collaboration between the electronics industry, government, academia, and research institutions.
Atotech’s experts will be present at booth K2376 on the 1st floor to discuss the latest technology, trends, and future requirements.
Highlights at the booth will include:
- Spherolyte Cu UF3—a high purity ECD copper process that enables stable and optimal mechanical properties within a wide process window
- AgPrep—an ultimate non etching adhesion promoter for silver surfaces
- MultiPlate—a new system platform for FOWLP / FOPLP
We are also pleased to announce that Atotech’s semiconductor expert, Dr. Ralf Schmidt, will talk about the “Holistic Approach to Improve the Reliability of Advanced Heterogeneous Packaging by Chemistry” in the session, ´SiP Global Summit 2019—Heterogeneous Integration NOW & FUTURE—Day 3´ on Friday, September 20, from 11:40 a.m. to 12:05 p.m..
Visitors to the show are invited to attend this presentation and stop by our booth K2376 to learn more about this and other innovative products, equipment, and process solutions Atotech provides to the semiconductor industry.
Spherolyte Cu UF3 – Electrolytic Cu process for RDL, fine-line RDL, RDL+ VIA, Pillar
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.
For more information about Atotech or its product offering, please visit www.atotech.com.
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