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In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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iNEMI’s PCBA Cleanliness End-of-Project Webinar
September 19, 2019 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCBA Cleanliness project looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs). Using single-row QFN component packages as a representative example of a BTC on a multi-quadrant test board, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). This was followed by surface insulation resistance (SIR), ion chromatography (IC) and other testing to determine the trade-offs between electrical performance, ionic contamination levels, and cleanliness.
Join the PCBA Cleanliness project team to review the results of their work. Two sessions are scheduled, and the webinar is open to members and non-members. Registration is required.
Session 1 (APAC)
Tuesday, October 8
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now
Session 2 (EMEA and Americas)
This session rescheduled
Monday, October 7 (Originally scheduled for Tuesday, October 8)
11:00 a.m. — noon. EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.