Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
iNEMI’s PCBA Cleanliness End-of-Project Webinar
September 19, 2019 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCBA Cleanliness project looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs). Using single-row QFN component packages as a representative example of a BTC on a multi-quadrant test board, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). This was followed by surface insulation resistance (SIR), ion chromatography (IC) and other testing to determine the trade-offs between electrical performance, ionic contamination levels, and cleanliness.
Join the PCBA Cleanliness project team to review the results of their work. Two sessions are scheduled, and the webinar is open to members and non-members. Registration is required.
Session 1 (APAC)
Tuesday, October 8
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now
Session 2 (EMEA and Americas)
This session rescheduled
Monday, October 7 (Originally scheduled for Tuesday, October 8)
11:00 a.m. — noon. EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now
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