Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
iNEMI’s PCBA Cleanliness project looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs), with particular focus on ionic contamination levels. Using single-row QFN component packages as a representative example of a BTC, the team utilized clean and no-clean solder pastes, conducted various levels of cleaning (no-clean, water clean and solvent clean) and then conducted testing using methods such as SIR and ion chromatography, in an effort to understand functional performance when residues are present underneath these packages.
Join the PCBA Cleanliness end-of-project webinar to review the results of this study. Two sessions are scheduled (October 7 & 8). The webinar is open to members and non-members; registration is required.
