Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
iNEMI’s PCBA Cleanliness End-of-Project Webinar Two Sessions Scheduled
October 3, 2019 | iNEMIEstimated reading time: Less than a minute
Join iNEMI to review the findings of PCBA Cleanliness project, which looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs), with particular focus on ionic contamination levels. Using single-row QFN component packages as a representative example of a BTC, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). They then conducted testing using methods such as SIR and ion chromatography in an effort to understand functional performance when residues are present underneath these packages.
Join the PCBA Cleanliness end-of-project webinar to review the results of this study. Two sessions are scheduled (October 7 & 8). The webinar is open to members and non-members; registration is required.
EMEA & Americas Session
PLEASE NOTE: This session re-scheduled from October 8
Monday, October 7, 2019
11:00 a.m. — noon EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now
APAC Session
Tuesday, October 8, 2019
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now
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