-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
NeodenUSA to Attend AES New York Convention 2019
October 14, 2019 | NeodenUSAEstimated reading time: 1 minute
NeodenUSA will attend and exhibit at the 2019 AES ultimate pro audio convention in New York. The event is running from October 16-19 of this year, with exhibits showing from the 16-18. The team from NeodenUSA will be holding their own booth at the convention, which is being held at the Jacob K. Javits Convention Center, 655 W 34th Street. Interested parties can find them at booth #248 in the AES Exhibition Hall to discuss their products and work.
NeodenUSA LLC offers SMT equipment, pick and place machinery, solder printers, reflow ovens, and much more for the manufacturing process of SMT PCB boards used in music and professional audio products. Team members from across the company will be traveling to New York City for the convention this October with the aim to exhibit their work, attend presentations from industry leaders and win new business. Based out of West Milford, New Jersey, the company also has offices in Phoenix, Arizona and Long Island, New York. NeodenUSA is helmed by Peter Swann, company president, a corporate lawyer, audio electronics engineer and musician. The company's VP for Sales and Marketing, Gil Griffith, has a long career history of launching successful pro audio and music brands and products.
The AES New York Pro Audio Convention is returning in 2019 for its 147th event. Its all access program features exhibits, training sessions and speeches aimed at engineers, students, and people working in the audio industry. There will be presentations and panels on audio for music production, video games, cinema, specialist music genres, electronic instrument design, and much more. Featured exhibitors this year include DELL Inc., GIK Acoustics and Focusrite Pro. Hundreds of presenters are lined up for the event, including Phillip Kovats of Sony Interactive Entertainment and Jack Vad of San Francisco Symphony. There will also be experts in audio, music and acoustics from universities across the world, from the USA to the UK, China, Germany and beyond. So vast is the array of training sessions and speeches being held at the event, the AES NY 2019 website features a handy Show Planner for attendees to compile and organize their schedule for the event.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.