New Design Strategy Can Help Improve Layered Superconducting Materials
October 14, 2019 | Tokyo Metropolitan UniversityEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/1316/3132/0350/crystal.jpg)
Scientists from Tokyo Metropolitan University have created a new layered superconducting material with a conducting layer made of bismuth, silver, tin, sulfur and selenium. The conducting layer features four distinct sublayers; by introducing more elements, they were able to achieve unparalleled customizability and a higher "critical temperature" below which superconductivity is observed, a key objective of superconductor research. Their design strategy may be applied to engineer new and improved superconducting materials.
Once an academic curiosity, superconductors are now at the cutting edge of real technological innovations. Superconducting magnets are seen in everyday MRI machines, particle accelerators for medical treatments, not to mention the new Chuo Shinkansen maglev train connecting Tokyo to Nagoya currently being built. Recently, a whole new class of "layered" superconducting structures have been studied, consisting of alternate layers of superconducting and insulating two-dimensional crystalline layers. In particular, the customizability of the system has garnered particular interest in light of its potential to create ultra-efficient thermoelectric devices and a whole new class of "high temperature" superconducting materials.
A team led by Associate Professor Yoshikazu Mizuguchi from Tokyo Metropolitan University recently created a bismuth sulfide based layered superconductor; their work has already revealed novel thermoelectric properties and an elevated "critical temperature" below which superconductivity is observed. Now, working with a team from the University of Yamanashi, they have taken a multi-layered version of the system, where the conducting layer consists of four atomic layers, and begun swapping out small proportions of different atomic species to probe how the material changes.
Starting with a conducting layer made of bismuth, silver and sulfur, they tried substituting some of the silver for tin. By varying the amount of silver, they were able to raise the critical temperature from 0.5K to above 2.0K. Interestingly, they found that this was accompanied by the disappearance of an anomaly in its resistivity at significantly higher temperatures. Though the reason behind this is not yet understood, it is clear that the addition of tin has significantly modified the electronic structure of the material. Furthermore, they took their best bismuth, silver, sulfur and tin combination and substituted some of the sulfur for selenium, a modification known to improve superconducting properties in their original bismuth sulfide material. Not only did they raise the critical temperature further to 3.0K, they found that the response to magnetic fields showed signatures of "bulk" superconductivity, providing clear proof that they could in fact access both the advantages of reduced dimensionality and bulk materials.
By changing the composition and number of layers, the team believe they are on the verge of achieving bottom-up engineering of new, tailored bismuth sulfide based superconducting materials.
Suggested Items
Indium to Showcase Durafuse Solder Technology at Productronica India
09/02/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.
Indium to Highlight High-Reliability Solder Solutions at SMTA Guadalajara
08/28/2024 | Indium CorporationIndium Corporation® will feature a range of industry-leading, high-reliability solder products at the Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico, September 11-12.
My Drop Shock Testing Experiments to Determine Reliability in PCBs
08/14/2024 | Palash Vyas, Ph.D, Graduate Research AssistantTablets, digital cameras, and smartphones are portable electronics that have become increasingly popular. Compact design and improved functionality are common product and package design trends. However, because they are portable, these devices may fall and cause internal damage. In addition, customers may use products in different environments, exposing them to risks that could cause harm. For example, a smart device such as a phone or tablet could be dropped while being used, or a warehouse shipment could be handled carelessly and fall. Products must have sufficient mechanical shock reliability to reduce the likelihood of damage.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.
Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content
08/08/2024 | Indium CorporationIndium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.