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UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.

KIC to Discuss Revolutionary Contact-less Thermal AnalysisTM at SMTA Dallas Expo and Tech Forum

02/09/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal AnalysisTM, at the SMTA Dallas Expo and Tech Forum.

AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at IPC APEX 2024

02/09/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC APEX EXPO 2024 taking place April 9-11 at the Anaheim Convention Center in Anaheim, California.

iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based Low-Temperature Solder Joints

02/05/2024 | iNEMI
There is an increasing interest in some market segments to use solder alloys with lower melting temperatures for electronics assembly. Low-temperature solder (LTS) can provide manufacturing, economic, and environmental benefits.

iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based Low-Temperature Solder Joints

01/31/2024 | iNEMI
There is an increasing interest in some market segments to use solder alloys with lower melting temperatures for electronics assembly. Low-temperature solder (LTS) can provide manufacturing, economic, and environmental benefits. Since 2015, the iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability project has been evaluating LTS paste formulations based on the Bi-Sn system.
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