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Nolan's Notes: The Rise (and Risk) of Data

11/05/2024 | Nolan Johnson -- Column: Nolan's Notes
Last month, I read about a United Airlines flight that declared an emergency over the middle of Hudson Bay in northern Canada. All the cockpit screens had gone blank and both flight management computers had entered into a “degraded mode with limited capabilities.” The pilots had lost most of their autopilot functionality, but still had enough control systems to manually fly the plane to a safe landing at O’Hare.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design

10/30/2024 | Siemens
Siemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.

Scanfil Continues to Succeed in Defending its Profit Margin in Challenging Market

10/29/2024 | Scanfil
Scanfil updated its outlook for 2024 on 10 June. Scanfil estimates its turnover to be EUR 780–840 (previous, issued on 23 February: 820–900) million, and an adjusted operating profit of EUR 54–61 (57–65) million.

North American PCB Industry Shipments Down 24.1% in September

10/29/2024 | IPC
IPC announced the September 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.
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