The New Chapter: Navigating Maternity Leave in the Electronics Industry
American Made Advocacy: There's No Substitute for American-made Microelectronics
It’s Only Common Sense: When Will Big Companies Start Paying Their Bills on Time?
The Conference Board Leading Economic Index for the U.S. Declined Slightly
October 21, 2019 | The Conference BoardEstimated reading time: 1 minute
The Conference Board Leading Economic Index (LEI) for the U.S. declined 0.1% in September to 111.9 (2016 = 100), following a 0.2% decline in August, and a 0.4% increase in July.
“The US LEI declined in September because of weaknesses in the manufacturing sector and the interest rate spread which were only partially offset by rising stock prices and a positive contribution from the Leading Credit Index,” said Ataman Ozyildirim, Senior Director of Economic Research at The Conference Board. “The LEI reflects uncertainty in the outlook and falling business expectations, brought on by the downturn in the industrial sector and trade disputes. Looking ahead, the LEI is consistent with an economy that is still growing, albeit more slowly, through the end of the year and into 2020.”
The Conference Board Coincident Economic Index (CEI) for the U.S. was unchanged in September, remaining at 106.4 (2016 = 100), following a 0.3% increase in August, and no change in July.
The Conference Board Lagging Economic Index (LAG) for the U.S. increased 0.1% in September to 108.3 (2016 = 100), following a 0.4% decline in August, and a 0.7% increase in July.
About The Conference Board Leading Economic Index (LEI) for the U.S.
The composite economic indexes are the key elements in an analytic system designed to signal peaks and troughs in the business cycle. The leading, coincident, and lagging economic indexes are essentially composite averages of several individual leading, coincident, or lagging indicators. They are constructed to summarize and reveal common turning point patterns in economic data in a clearer and more convincing manner than any individual component – primarily because they smooth out some of the volatility of individual components.
About The Conference Board
The Conference Board is the member-driven think tank that delivers trusted insights for what’s ahead. Founded in 1916, we are a non-partisan, not-for-profit entity holding 501 (c) (3) tax-exempt status in the United States. www.conference-board.org.
Share on:
Suggested Items
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
Real Time with... SMTAI 2024: SMTA Austin on the Grow
11/04/2024 | Real Time with...SMTAIIn this interview from SMTAI 2024, Nolan Johnson chats with SMTA Austin Chapter Treasurer Brad Pagano, who shares what he's learned in his first 10 months of board service with this growing chapter. His insights are good advice for board members in other chapters.
CEE PCB to Exhibit at Electronica 2024
10/31/2024 | CEE PCBTom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.