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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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iNEMI Webinar on Survey Results for PIC Coupling
October 21, 2019 | iNEMIEstimated reading time: Less than a minute
iNEMI will be holding a webinar on October 30, which will review the results of the recent survey on edge versus vertical coupling to photonic integrated circuits (PICs), and discuss the development of a demonstrator module.
The survey was conducted as part of the ongoing Board-Level Optical Interconnect project, a collaborative effort between iNEMI and IPSR-I (Integrated Photonics Systems Roadmap-International). The responses helped identify which design and performance attributes are of greatest importance to PIC manufacturers and users.
This webinar will summarize the inputs received from across the supply chain, and results of the survey will be incorporated into the design specifications of an optical demonstrator module which the team is considering assembling in the next 24-month period.
For more information, click here.
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I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.
ASC Sunstone Circuits to Exhibit at AEMS 2025
09/09/2025 | American Standard CircuitsASC Sunstone Circuits will be exhibiting at AEMS 2025 (Anaheim Electronics and Manufacturing Show) to be held at the Anaheim Convention Center on September 24 and 25, 2025.