A Technology to Transform 2D Planes Into 3D Soft and Flexible Structures by Engineering Adhesion Between Thin-Films
October 23, 2019 | DGISTEstimated reading time: 2 minutes

DGIST announced that Professor Sohee Kim’s research team in the Department of Robotics Engineering succeeded in developing a technology to produce flexible 3D medical devices. It is expected to be used in developing various devices with embedded electrical functionality or soft robots.
Professor Sohee Kim’s team developed a new technology for 3D device production that selectively bonds polymeric thin films using plasma. Since this technology can manufacture 3D flexible devices more easily than the existing methods, it is expected to have a positive impact on the future research.
The existing flexible 3D structures could not avoid manual handling such as directly gluing the top and bottom layers of the structure, or transferring pre-strained patterns on the substrate, which has limited the production efficiency at a very low level.
However, Professor Kim’s team created 3D flexible structures by generating covalent bonds only at the edges of patterns formed between two polymeric thin films with plasma and by injecting air into non-bonded patterns (namely, balloons) to inflate them. Moreover, the new 3D structures can be used as a sensor or actuator because metal wires can be easily patterned inside and outside the balloons.
A customized 3D device that is in contact with a complicated surface can also be produced using the technology developed by Professor Kim’s team. Since the 3D device is inflated like a balloon where the device is put on, it can have a customized shape along the curvature of a body part with a complex surface, like the human brain.
In addition, wire patterns in the micrometer scale can be easily formed inside and outside the 3D structure, which has been difficult so far in the production of 3D structures using conventional microelectromechanical systems (MEMS) technologies. It is expected to be widely applied, for instance, for pressure measurement inside the body including the cranium, devices with electrical stimulation and detection functions, and soft robots.
The result of this study was published on the supplementary front page of the ‘ACS Applied Materials & Interfaces’ of the American Chemical Society on Wednesday, October 2. This study was conducted with supports from Basic Research Program of the South Korean Ministry of Science and ICT as well as the DGIST. Ph.D. candidate Hyunmin Moon in the Department of Robotics Engineering and post-doctoral researcher Namsun Chou at Korea Institute of Science and Technology participated in the research as the first co-authors.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.