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Flex Connections: Material Selection in Nickel vs. Copper Tabs

09/17/2026 | Zack Schaner -- Column: Flex Connections
Flexible printed circuits are being designed to do more than route signals. In many applications, the flex circuit must also provide robust electrical interfaces, mechanical reinforcement, and reliable transitions between the circuit and surrounding assemblies. One effective way to accomplish this is by integrating copper or nickel tabs directly into a flexible printed circuit.

PCB Design Takes Center Stage at FED’s Design Awards

09/17/2026 | Marcy LaRont, I-Connect007
PCB designers often work behind the scenes, but their decisions can determine whether an electronic product succeeds in manufacturing. At the FED Annual Conference in Germany on Sept. 23, the PCB Design Award 2026 will put that work in the spotlight. Marcy LaRont interviewed FED Managing Director Christoph Bornhorn and board member Erika Reel about what makes a winning design, and how the profession is changing as AI, automation, and other technologies reshape electronics development.

GSME Joined TSMC OIP Value Chain Alliance in North America

09/16/2026 | PRNewswire
GS Microelectronics U.S., Inc. (GSME), a leading semiconductor solutions provider, announced it has officially joined TSMC's Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a member partner in North America.

September I-Connect007 Magazine Pairs PCB Automation With Human Expertise

09/16/2026 | I-Connect007 Editorial Team
The September issue of I-Connect007 Magazine examines why employee experience and judgment remain essential as manufacturers bring more automation onto the shop floor. Industry experts share how companies can combine these strengths to improve processes without losing the knowledge behind them. Plus: We cover what's going in with the European PCB Design community.

Designing for a More ‘Intelligent’ and Connected Future

09/15/2026 | Marcy LaRont, I-Connect007 Magazine
With more collaborative and computationally demanding PCB designs, cloud-based workflows are rapidly moving from possibility to reality. But greater connectivity also raises new questions about data security, intellectual property, and the sharing of design information in an increasingly complex electronics ecosystem. In this interview, Kristin Moyer of the Global Electronics Association explores the benefits and challenges of cloud-based design environments, the growing importance of standardized data transfer protocols such as IPC-1751 and IPC-2581, and why a secure, intelligent data ecosystem will be essential for the future of co-design, automation, and advanced electronics manufacturing.
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