Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers
October 29, 2019 | Adesto Technologies CorporationEstimated reading time: 1 minute
Adesto Technologies Corporation (NASDAQ: IOTS), a leading provider of innovative application-specific semiconductors and systems for the Internet of Things (IoT), has joined the STMicroelectronics Partner Program to enable optimal system operation for emerging IoT devices through the combination of its non-volatile memory (NVM) devices and the STM32 line of microcontrollers (MCUs).
Adesto has been collaborating with ST to optimize the combination of the latest Adesto NOR flash memory products with STM32 MCUs to ensure customers can get to market quickly with high-performance, highly efficient systems that leverage external memory. Adesto’s memories include application-specific features such as optimization for high-bandwidth, eXecute-in-Place (XiP) operation, data logging and low-power designs. Initial power and performance benchmark results show that the STM32 MCUs are able to take full advantage of these valuable features for enhanced system performance.
“By joining the ST Partner Program, we’re strengthening our ongoing collaboration and accelerating time-to-market for customers whose systems can benefit from external memory,” said Graham Loveridge, VP marketing, memory products, at Adesto. “We are seeing increasing interest in our NVMs including EcoXiP™ octal xSPI devices and the highly efficient FusionHD™ NVMs. We anticipate that the system benchmarks of these devices combined with STM32 MCUs will be increasingly compelling as ST continues to roll out future devices.”
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications created the ST Partner Program to help customers’ design teams access extra skills and resources to speed customer development efforts. By identifying and making customers aware of ST-Partner companies with complementary products and services, and adding a certification process that assures that all partners are periodically vetted for quality and competence, the ST Partner Program accelerates design and product development and shrinks time-to-market for new products.
About Adesto Technologies Corporation
Adesto Technologies Corporation (NASDAQ:IOTS) is a leading provider of innovative application-specific semiconductors and embedded systems for the IoT. The company’s technology is used by more than 5,000 customers worldwide who are creating differentiated solutions across industrial, consumer, medical and communications markets. With its growing portfolio of high-value technologies, Adesto is helping its customers usher in the era of the Internet of Things.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.