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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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ADEON Technologies to Represent Meyer Burger in the European Market
October 29, 2019 | ADEON TechnologiesEstimated reading time: 1 minute
Meyer Burger and ADEON Technologies have entered an agreement in which Adeon will represent Meyer Burger's inkjet soldermask technology "PiXDRO JETx" systems into the European PCB manufacturing industry. Meyer Burger has successfully developed the technology over the last 7 years, starting in 2012.
The PiXDRO JETx fits perfectly to the portfolio of Adeon and the two companies have already shared a lot of information and knowledge. Meyer Burger has already 2 successful installations in the European PCB market and with the Productronica coming up from November 12-15 - 2019, both companies are excited about the opportunity to expand the Meyer Burger footprint immediately. In the start-up phase of the relationship, Adeon will take care of the commercial entry of the PiXDRO JETx system, which is to be expanded into a cooperation to include service and support in the future.
Adeon will be exhibiting a PiXDRO JETx system at its booth during Productronica. Meyer Burger specialists will be happy to show the technology and welcomes everyone to visit Adeon and Meyer Burger in Hall B3, Stand 425.
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Julia McCaffrey - NCAB GroupSuggested Items
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05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Sharp Increase in Global Semiconductor Sales in Q1 2026
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Infineon Brings Industrialization Expertise to European Quantum Chip Pilot Lines
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Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
04/30/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
Kitron Secures EUR 37 Million Order for Next-Generation Tactical Communication Equipment
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