-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Saki to Showcase AOI Solutions for Ensuring Soldering Quality at Productronica 2019
November 1, 2019 | Saki CorporationEstimated reading time: 2 minutes

Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, introduces a compact, lightweight, inline 3D-CT automated X-ray inspection machine, the 3Xi-M110, for inspection of printed circuit board assemblies (PCBAs). The 3Xi-M110 reduces the dose and exposure to X-rays during inspection and features new soldering quality inspection functions for PCB assembly applications. Saki will demonstrate the PCB inspection capabilities of the 3Xi-M110 at productronica 2019, being held in Munich, Germany from November 12-15, in stand A2.259.
Saki's new X-ray inspection system ensures the quality of hidden solder joints for bottom-electrode packages, such as BGAs, LGAs, and QFNs, which are found in advanced embedded devices, telecommunications, and automotive products. Saki's Planar Computed Tomography (PCT) provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow (HiP), and other defects that are extremely difficult to identify.
The 3Xi-M110 hardware platform is 1,380mm wide and weighs 3,100kg, making it 40% lighter and reducing its footprint by 25% over its predecessor. Manufacturing floorspace is saved, it's easy to install, and production-line operation is significantly improved. Although the cast iron frame is lighter in weight, it maintains the rigidity needed for stable operation and accuracy, while the imaging range has been optimized to handle board sizes up to 360 x 330mm (W x L). For larger 360 x 510mm (W x L) boards, 2-step image capture is available.
The 3Xi-M110 delivers exceptional speed and accuracy by utilizing a double motor-driven system equipped with a high-precision linear scale manufactured by Magnescale Co., Ltd. to optimize power and precision. Saki's enhanced PCT technology algorithm improves image capture speed by 30%, reducing production-line takt time.
One of the most significant features of the new system is Saki's revolutionary X-ray tube, which can reduce X-ray exposure up to 70% by powering on the X-rays only at the moment of image capture. An exposure dose simulator allows the user to monitor the radiation dose. Based on that information, the method and magnification for releasing the X-rays can be set. The new X-ray tube design does not require periodic maintenance or spare parts, and the built-in monitoring system reports when the tube needs replacing.
"In the automotive and communications industries, where quality assurance is important, the effectiveness of high-precision, high-quality PCB X-ray inspection has become critical," said Masahide Iino, director and head of the sales division of Saki Corporation. "Saki will continue to respond to the needs of the market by leveraging the accumulated knowledge and experience it has gained through its history as a leading innovator in the field of 2D/3D automated optical inspection and X-ray inspection."
For more information on the 3Xi-M110, please contact Saki at pr@sakicorp.com, or visit our website at www.sakicorp.com or www.sakiglobal.com.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.