-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki to Showcase AOI Solutions for Ensuring Soldering Quality at Productronica 2019
November 1, 2019 | Saki CorporationEstimated reading time: 2 minutes

Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, introduces a compact, lightweight, inline 3D-CT automated X-ray inspection machine, the 3Xi-M110, for inspection of printed circuit board assemblies (PCBAs). The 3Xi-M110 reduces the dose and exposure to X-rays during inspection and features new soldering quality inspection functions for PCB assembly applications. Saki will demonstrate the PCB inspection capabilities of the 3Xi-M110 at productronica 2019, being held in Munich, Germany from November 12-15, in stand A2.259.
Saki's new X-ray inspection system ensures the quality of hidden solder joints for bottom-electrode packages, such as BGAs, LGAs, and QFNs, which are found in advanced embedded devices, telecommunications, and automotive products. Saki's Planar Computed Tomography (PCT) provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow (HiP), and other defects that are extremely difficult to identify.
The 3Xi-M110 hardware platform is 1,380mm wide and weighs 3,100kg, making it 40% lighter and reducing its footprint by 25% over its predecessor. Manufacturing floorspace is saved, it's easy to install, and production-line operation is significantly improved. Although the cast iron frame is lighter in weight, it maintains the rigidity needed for stable operation and accuracy, while the imaging range has been optimized to handle board sizes up to 360 x 330mm (W x L). For larger 360 x 510mm (W x L) boards, 2-step image capture is available.
The 3Xi-M110 delivers exceptional speed and accuracy by utilizing a double motor-driven system equipped with a high-precision linear scale manufactured by Magnescale Co., Ltd. to optimize power and precision. Saki's enhanced PCT technology algorithm improves image capture speed by 30%, reducing production-line takt time.
One of the most significant features of the new system is Saki's revolutionary X-ray tube, which can reduce X-ray exposure up to 70% by powering on the X-rays only at the moment of image capture. An exposure dose simulator allows the user to monitor the radiation dose. Based on that information, the method and magnification for releasing the X-rays can be set. The new X-ray tube design does not require periodic maintenance or spare parts, and the built-in monitoring system reports when the tube needs replacing.
"In the automotive and communications industries, where quality assurance is important, the effectiveness of high-precision, high-quality PCB X-ray inspection has become critical," said Masahide Iino, director and head of the sales division of Saki Corporation. "Saki will continue to respond to the needs of the market by leveraging the accumulated knowledge and experience it has gained through its history as a leading innovator in the field of 2D/3D automated optical inspection and X-ray inspection."
For more information on the 3Xi-M110, please contact Saki at pr@sakicorp.com, or visit our website at www.sakicorp.com or www.sakiglobal.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.