-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Techcon to Demo New Jet Valve Dispensing System at productronica
November 5, 2019 | TechconEstimated reading time: 1 minute
Techcon, a leader in precision fluid dispensing technologies, plans to exhibit in Hall A2, Booth 135 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The company will showcase its new TS9800 Series Jet Valve Dispensing System, TS8100 Series Progressive Cavity Pump and TSR2000 Smart Dispensing Robots.
The TS9800 Series Jet Valve Dispensing System includes the TS9800 Piezo-actuated jet valve and TS980 Smart Controller. Unlike pneumatic jet valves and other contact dispensing solutions, the TS9800 Jet Valve utilizes Piezo, non-contact jetting technology for increased speed and reduced scrap during the dispensing process.
The Techcon TS9800 Jet Valve provides ultra-fast dispensing speeds and the capability to dispense dots and lines as small as 0.5nL at up to 1500 Hz continuous and 2000 Hz max bursts for higher throughput on a wide range of fluid types and viscosities.
The TS8100 Series Positive Displacement Pump is designed to dispense a wide range of fluids, from low viscosity coatings to high viscosity greases. Typical applications include under filling PCBA components, encapsulation and potting applications, applying lubrication on automotive parts, and dispensing pastes and flux.
TSR2000 Series Smart Dispensing Robots are designed specifically for precise fluid dispensing applications and are compatible with all valve types and controllers. The user-friendly, smart PC based software make the robots easy to program and simple to operate.
“From a general assembly manufacturer looking to automate an existing dispensing application, to an engineer designing a production process from the very beginning, the Techcon smart dispensing robots offer unsurpassed value in automated precision fluid dispensing,” said Rick Nuttall, Director of European Sales for Techcon.
Suggested Items
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum
11/21/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Silicon Valley Expo & Tech Forum on Thursday, December 5, 2024 at the Fremont Marriott Silicon Valley in Fremont, CA.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
10/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.