-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nordson SELECT to Exhibit Selective Soldering Technology at Productronica 2019
November 6, 2019 | Nordson SELECTEstimated reading time: 1 minute
Nordson SELECT, a Nordson company (NASDAQ: NDSN), is pleased to announce it will exhibit its advanced selective soldering technology in Hall A2, Stand 345 at the Productronica 2019, scheduled to take place November 12-15, 2019 at the Messe Munich Convention Center in Munich, Germany.
On exhibit will be the Integra® 508.2 multi-station selective soldering system designed for high-volume applications with maximum throughput. Customers can choose between three different variants of the Integra® 508.2 to meet a broad range of selective soldering requirements. The Integra® 508.2S configuration equipped with single fluxer and solder pot provides single board processing.
The Integra® 508.2PD configuration with dual drop-jet fluxers and dual solder pots allows for using two solder nozzles in the same soldering station or processing two boards in a panel simultaneously. The Integra® 508.2PD 2seg configuration can solder two singulated boards in-line providing sequential soldering of two printed circuit boards at the same time without the need for the boards to be in a panel, to be palletized or to require tooling. All variants of the Integra® 508.2 are available with Nordson SELECT’s unique automatic solder nozzle cleaning system, which unlike other nozzle cleaning systems, does not spray a liquid or powdered flux, or adipic acid.
Nordson SELECT’s new FX-942 automated solder joint inspection system will be on display showcasing its dual-sided optical inspection capability of plated through-hole, SMT and PCB inspection. The FX-942 can be paired with any Nordson SELECT in-line selective soldering system and provides the ideal solution to ensure optimum solder joint integrity.
Also on display will be the Novo® 460 and Novo® 300 selective soldering systems. The Novo® 460 selective soldering system is available as a 460S and 460PD model and is one of the most flexible system in the Nordson SELECT product portfolio. The Novo® 300 is a standalone platform ideally suited for prototype, cell manufacturing or small batch production with a compact footprint requiring less than 1.1 square meters of factory floor space.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in