Microsoft Rolls Out New Cloud Tool for Analyzing Business Data
November 7, 2019 | ReutersEstimated reading time: 1 minute

Microsoft Corp announced a new service aimed at helping large businesses put to use the huge amounts of data stored in corporate systems.
The Azure Synapse system, to be unveiled at an event in Florida, is part of the company’s fast-growing cloud computing unit, which has driven the company’s shares up over the past five years. The tool is meant to help companies build out systems that analyze large amounts of data to make better business decisions, such as whether a digital marketing campaign is driving more traffic to stores and websites.
The Synapse aims to solve two problems for businesses building those systems, Rohan Kumar, the corporate vice president of Azure Data, told Reuters in an interview.
The first is that businesses need different software tools to analyze data held in systems like customer databases—where names and addresses sit in neat rows and columns and look like a spreadsheet—versus newer systems like website monitoring tools, where clicks are recorded as a long stream of numbers and time stamps. The Synapse tool is designed to handle both kinds of data, he said.
Second, the Synapse system automatically handles some of the tasks for building out a system to analyze data, reducing the amount of work needed from computer programmers. Deutsch Bank and Unilever are among the customers testing the system, Microsoft said.
“What we’re seeing with our customers is these projects that would typically take multiple months are now getting completed within a day,” Kumar said.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.