-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Saki Corporation Unveils New Inspection Systems and Software at productronica
November 7, 2019 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, will demonstrate new inspection and measurement systems and software at productronica, being held in Munich, Germany, from November 12-15, 2019, at stand A2.259. Saki is also participating in the 3D AOI Arena, sponsored by EPP and EPP Europe, at stand A2.506.
Saki is demonstrating its new 3D AXI system for printed circuit board assemblies (PCBAs), the 3Xi-M110 inline 3D-CT automated X-ray inspection system. In addition, Saki will be introducing a new system for the advanced semiconductor packaging industry, an inline 3D-CT automated X-ray inspection system for insulated gate bipolar transistors (IGBTs).Saki's Planar Computed Tomography (PCT) provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow (HiP), and other defects that are extremely difficult to identify. Saki's 3D AXI system for PCBAs has a revolutionary new X-ray tube which can reduce X-ray exposure up to 70% by powering on the X-rays only at the moment of image capture.
On display will be Saki's ultra-fast 2Di-LU1 bottom-side AOI system for through-hole soldering inspection. This versatile system automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.
Saki will also demonstrate its accurate and fast 3D AOI and 3D SPI systems. The entire lineup of Saki 3D inspection and measurement systems, with one common software and hardware platform, provides cost and operational benefits. The system captures extremely clear, detailed images, with no shadowing, for inspection of the most challenging defects, such as non-wetting solder, lifted leads, tombstones, reverses, and height variations.
Saki has partnered with Cogiscan to speed the development of Smart Factory Solutions. By incorporating Cogiscan's TTC solutions into its inspection systems, Saki will be able to expand the manufacturing software capabilities of its SPI, AOI, and AXI software. A new Saki software suite will be introduced and demonstrated at productronica.
Saki continues to be on the forefront of M2M communication to realize the Smart Factory Solution and Industry 4.0 and has established relationships with many of the leading companies in the electronics assembly industry. Saki adheres to the standards set forth by the SMT equipment communication protocol standardization subcommittee (JARA), the Hermes Standard, and IPC/CFX.
"2019 has been a busy year for Saki with new products, technologies, partnerships, and growth. We recently moved to new facilities in Shenzhen, China and the Czech Republic and expanded our applications and demonstration center in Tokyo," said Masahide Iino, director and head of the sales division of Saki Corporation. "We invite both SEMICON Europa and Productronica attendees to visit our booth in Munich. For those not attending, please arrange a visit to one of our worldwide showrooms."
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in