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Finding Lead Time in the Messy Middle

11/11/2026 | Ralph Richart, MetisLogic
As electronics manufacturers, we devote significant effort to the production floor, always seeking to build products better and faster. We measure placement speed, optimize changeovers, monitor yield, and invest in equipment. Those investments matter. But in many high-mix and new product introduction (NPI) environments, the greatest opportunity to shorten lead time sits between the customer order and the start of production. I call this the Messy Middle. It is the period when a quoted job becomes a buildable job.

Catching Up With Echo Yang of Archer Circuits

11/10/2026 | Dan Beaulieu, D.B. Management Group
I’ve always believed the most interesting thing about a PCB company is the person who decided what kind of company it should be. Echo Yang chose to build Archer Circuits around engineering support, manufacturing options, and long-term customer relationships. I caught up with Echo to talk about the road that led her here, what customers are asking for today, and what it takes to earn their trust. I think you will be surprised and, frankly, as impressed as I was by Echo and her company.

Green Circuits Appoints David Kim as Vice President of Quality

11/04/2026 | Green Circuits
Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, has appointed David Kim as Vice President of Quality.

Muon Space Expands Leadership Team as Company Scales Constellation Programs

10/19/2026 | Muon Space
Muon Space, the Mission Foundry for high-performance satellite constellations, announced two additions to its leadership team as the company scales production and expands a growing portfolio of commercial and government constellation programs. Jody Kelman has joined Muon as Chief Product Officer, and Emelia Probasco has joined as Head of Strategy and Communications.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.
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