Nanusens MEMS-within-CMOS Technology Wins in Two Categories at TechWorks Awards 2019
November 8, 2019 | NanusensEstimated reading time: 1 minute

Nanusens—and its ultra-small, MEMS-within-CMOS sensor technology—was the only double-award-winning company at last night’s TechWorks Awards, picking up both the Disruptive Innovation of the Year category of 2019 and being named Emerging Technology Company of the Year. The awards celebrate the year’s key electronics innovations, people and companies from across the UK and Ireland. The TechWorks Awards have run annually since 2001—originally branded as the NMI Awards.
Dr. Josep Montanyà, Nanusens CEO, said, “We are honoured that our innovative technology and the company has been recognised by the judges. It supports our belief that we have a truly disruptive technology that will have a tremendous positive impact on the MEMS market. Not only does our technology enable us to shrink MEMS by a factor of ten down onto the nanoscale but it also enables us to make as many as we need because we use standard CMOS processes. This removes the current MEMS production bottleneck that is caused by MEMS requiring bespoke production lines so that volumes are hard to ramp without building a new line. Analysts have forecast that the demand for MEMS sensors will continue as more and more devices are made smarter with MEMS sensors. Current production techniques will not be able to meet this rapidly increasing demand but our technology of MEMS-within-CMOS can now enable the sensor market to grow from billions to trillions of units.”
The Emerging Technology Company of the Year category, sponsored by Cadence, honours a growing company showing excellent progress—demonstrating impressive growth in areas such as revenue, headcount, innovation, investment and/or market traction as success indicators.
The Disruptive Innovation Award, sponsored by CSA Catapult, is given to the company that can demonstrate a significant business impact through innovation. This can cover any aspects of innovation whether in business process, manufacturing, service provision or product development.
Award presenter Penny Power, OBE, commented: “The company impressed the judges with their development of existing CMOS technology leading to the elimination of specialised production techniques; thus increasing production capabilities and removing many of the current limitations. Nanusens predicts that it could increase the size of the sensor market from billions of units to trillions of units by solving this production bottleneck.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in