Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Seica Automation Showcases Automation Solutions at productronica
November 8, 2019 | SeicaEstimated reading time: 2 minutes
Seica Automation, a Seica Group company, will be showcasing their latest board handling and process automation solutions at productronica 2019 in Hall A3, booth 337.
The solutions on display will include an automated selective soldering and optical inspection line featuring Seica’s laser-based selective soldering system Firefly Next> and optical inspection system Dragonfly Next>.
The Firefly Next> is a new generation, technologically advanced solution, with its perfect integration, on a single axis, of a high-efficiency LASER source, fully-programmable donut spot, vision system and temperature sensor, redefines the levels of performance of selective soldering technology in terms of flexibility, throughput, reliability, applicability and process traceability.
The DRAGONFLY Next > provides optical inspection of THT components: the combination of multi-colored LED lighting and color scan camera enables detailed inspection of the solder joint meniscus and shorts detection, while the full scan acquisition of the PCB surface and not only of the components allows the detection of solder balls. The DRAGONFLY Next > series also includes the configuration for conformal coating inspection of finished products, as well as for process control and setup. Configurable for single and double sided inspection of the board, its intuitive and streamlined management software environment enables the user to develop and deploy an application program in a few hours.
The automated line on display exemplifies the solutions on offer from Seica Automation: the FLO line includes economical, standard, off-the-shelf solutions, while the FLEX line of board handlers can be highly customized to meet customer-specific requirements. Visitors will also be able to view the latest label applicator, which is one of Seica Automation’s full spectrum of automated process solutions including handlers, routers, laser marking, press fit, and Robotic process automation (RPA).
Among the process solutions on display is the new Label Applicator and the SERVO PRESS. The Label Applicator is dedicated to all board manufacturers that need to apply labels directly on Multipanel PCBs with position angle 0°- 360°. The Labeller can be used offline or deployed in a HIGH SPEED SMD Line (less than 2 Sec per label). The new X-Y gantry placing head ensure high accuracy placement, and allow insertion of 2 printers of different brands. The software is extremely flexible, permitting joint “Father-Child” or direct reading of data from the customer data base, and an optional camera can be included to assure quality in placing and quality with Grading Control.
The SERVO PRESS is an optimized solution for those processes that aim to produce precise assemblies by joining together low-cost individual components with different tolerances. Electrically driven spindle presses, servo presses, are ideal for such tasks, and SCHMIDT® Servo Press systems, distributed by Seica Automation, offer an integrated solution and meet the most complex requirements, as stand- alone machines or in automatic production lines.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.