-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Data I/O Enhances PSV7000 with Machine Learning-Based Automated Teach Capability
November 8, 2019 | Data I/O CorporationEstimated reading time: 2 minutes
Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data and security deployment solutions for flash, flash-memory based intelligent devices and microcontrollers today announced NexTeach™ Pro and handler performance enhancements to the PSV7000 that reduce job setup time by up to 4x and increase production throughput up to 24%, respectively. All existing PSV7000 customers are eligible to upgrade their systems immediately.
“Our customers continually ask how to maximize production output, reduce costs and minimize human error. Teaching new package types and programming jobs has historically been a source of error, downtime and yield loss in device programming, especially in automotive markets with a zero rework policy,” said Anthony Ambrose, President and CEO of Data I/O. “Data I/O’s NexTeach Pro and system software delivers one touch teaching with up to 4 times improvement in job set-up, up to 10 times better accuracy than before and significantly increases overall handler performance.”
NexTeach is Data I/O’s next generation of job teaching technology. NexTeach simplifies the teaching process by automating the XYZR measurements and coordinates with the single touch of a button. In addition, customers can now optimize the handler settings by package type, increasing speed and precision for the most demanding small parts and fine pitch packages. This allows customers to dial in the best possible performance for their application, with performance increases up to 24%. These enhancements are a testament to Data I/O’s leadership and continued investment to the pre-programming market for the automotive and IoT markets. Customers can take immediately take advantage of our latest enhancements.
The PSV7000 is the world’s premier automated programming solution with the speed, flexibility, fast changeover and small parts handling to manage any job for the lowest total cost of ownership. Engineered for velocity and versatility, the PSV7000 combines industry leading robotics handling, the LumenX revolutionary programming technology for fastest device programming and highest socket density. A comprehensive suite of process control software applications along with fiber laser marking and 3D co-planarity component inspection meets the demanding process requirements for automotive electronics applications and Industry 4.0 automation. System software updates are free to customers on an annual software maintenance contract and also available for one-time purchase.
Data I/O will showcase the PSV7000 with NextTeach Pro at the international productronica trade show November 12th – 15th in Munich, Germany in Hall A2 Booth 205. Customers may also learn more and see a video of NexTeach at www.dataio.com/PSV7000/NexTeach
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
ViTrox Americas Expands Reach in Southern U.S. with MaRCTex
11/21/2024 | ViTroxViTrox Americas Inc. is pleased to announce the appointment of MaRCTex Inc. as its new representative for the states of Texas, Louisiana, Oklahoma and Arkansas. Led by industry veteran Mike Gunderson, MaRCTex has a proven track record of supplying essential tools and solutions for the electronics manufacturing and high-tech industry across the United States. Additionally, demos are available at the ViTrox Americas Demo Center in Hutto, Texas.
Offshore Sourcing in the Global Supply Chain
11/20/2024 | Brittany Martin, I-Connect007Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.