Lockheed Martin Appoints Leader of Future Vertical Lift Campaign
November 8, 2019 | Lockheed MartinEstimated reading time: 1 minute

Lockheed Martin announced the appointment of Andrew (Andy) Adams to oversee all strategic and operational aspects of its efforts to support Future Vertical Lift (FVL), which will shape the United States military’s helicopter fleet of the future. This appointment emphasizes that Lockheed Martin is bringing the full strength of its portfolio to FVL and demonstrates that the corporation is prepared to support accelerated fielding of these capabilities.
Led by the U.S. Army, FVL will create the next generation of rotary wing aircraft that are faster, more maneuverable, more lethal, and more technologically advanced.
Andy joins the Rotary and Mission Systems business from Aeronautics, where he was vice president and deputy general manager, F-35 Lightning II program. He has a diverse background in the aerospace industry with 31 years of experience within Lockheed Martin, including 29 with Lockheed Martin’s Advanced Development Programs (Skunk Works®). Andy brings unique skills to the role based on his deep involvement in the pursuit, capture and execution of highly complex, highly contested capture campaigns. His appointment is effective Nov. 18, 2019.
“Lockheed Martin is demonstrating its leap-ahead technologies today that will enable us to provide these critical capabilities to the U.S. Army in record time. For more than a decade, Sikorsky, a Lockheed Martin company, has been investing in game-changing X2 technology to support our customers’ FVL missions with increased speed, agility and maneuverability,” said Frank St. John, Executive Vice President, Rotary and Mission Systems.
“Coupled with our adaptable mission systems, sensors, weapons, advanced manufacturing, and training and sustainment solutions, Andy will ensure we bring the best of Lockheed Martin to Future Vertical Lift. He will lead the way as we advance industry and supplier partnerships with a stronger, centralized effort to meet our customers’ critical missions.”
Lockheed Martin’s FVL campaign will integrate capture initiatives for the Army’s Future Attack Reconnaissance Aircraft (FARA), for which Lockheed Martin is proposing its RAIDER X aircraft, and Future Long-Range Assault Aircraft (FLRAA), the Marine Corps’ Attack Utility Replacement Aircraft (AURA), as well as S-97 RAIDER, SB>1 DEFIANT and international efforts. The FVL campaign will bring employees and resources together into a unified organizational structure, increasing efficiencies and preparing Lockheed Martin for rapid development and delivery of game-changing technologies and capabilities.
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.