-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation’s Industry Partners to Feature ‘Live@Productronica’ Demonstrations
November 8, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program.
Live@Productronica benefits all participants, including Indium Corporation, its industry partners, and, most importantly, customers, through live product demonstrations on the show floor. These events provide attendees an accurate and honest depiction of material performance.
Live@Productronica 2019 partners include:
- Fuji Europe Corporation, Hall A3, Booth 317
- Häcker Automation, Hall B2, Booth 317
- Yamaha Motor Europe N.V. Branch Germany, Division IM, Hall A3, Booth, 323
Indium Corporation will feature the following products at partner booths as part of the Live@Productronica program:
- InFORMS®, reinforced solder preforms that help maintain the required bondline and promote good solder wetting.
- Core 230-RC, a no-spatter flux-cored wire specially developed to meet the demanding requirements of robotic and laser soldering.
- Indium3.2HF Solder Paste, an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
- Indium8.9HF Solder Paste, a no-clean, halogen-free solder paste designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
- TACFlux® 032-HF, a rework flux for Pb-free alloys in an air or inert gas reflow atmosphere, designed to provide excellent wetting in air or nitrogen atmospheres.
Indium Corporation’s products will also be used in internal customer demonstrations on the show floor.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.