Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Flex Standards Update With Nick Koop
November 21, 2019 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.
Andy Shaughnessy: Nick, tell us a little about your background and your work with flex and rigid-flex circuits at TTM.
Nick Koop: I’ve worked in the flex and rigid-flex world since 1985 where my roles have ranged from process engineer to design engineer to general manager of a factory. And I’ve been with TTM since 2013. It has been a great experience working with such a wide range of customers and programs, solving problems that lead to success for our customers.
Shaughnessy: You’re the vice-chair of the Flexible Circuits Committee and co-chair of the 6013 Subcommittee. Give us some updates on the flex committees.
Koop: All of the flex specifications are being reviewed on an ongoing basis. We are close to releasing new versions of IPC-2223 and IPC-6013. They will include more information on microvias, finished copper thickness, and other member-requested updates. I would expect that to happen by early 2020. The supporting material specifications and test methods are also under review. In addition, there is work happening on the T-50 Terms and Definitions Guideline, which is in the middle of a substantial update. So, there is a lot happening on all fronts.
Shaughnessy: We talk to a lot of rigid board designers who are being forced into flex design. Usually, they start with flex standards, and then hopefully, they will call a flex board shop. What advice would you give any rigid folks moving into the flex world?
Koop: We are also seeing dramatic growth in flex use driven by several factors; space, weight, reliability, and cost being some of the most common. Flex provides a lot of advantages over a rigid board and discrete wiring. My initial advice would be to gain an understanding of the similarities and differences. The key differences are unique materials and a variation in material movement, which can impact alignment.
To read this entire interview, which appeared in Flex007 in the September 2019 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
AT&S Sets New Standards in the Recycling of Copper and Chemicals
03/25/2025 | AT&SAT&S has been working for years to reduce the ecological footprint of its production sites worldwide with a comprehensive sustainability strategy and considerable investments.